TPU of Tomorrow

The New Business Segment - Recognizing and Shaping the Future

The New Business team pursues a double-track strategy as it analyzes the trends of the future.  First, the team scrutinizes a wide variety of industries to detect possible applications for plastics in future generations and then develop strategies to implement them.  Next, it sifts through and evaluates the latest processes and material developments in the plastics industry.  This results in ideas for projects which may be further developed to create new products and technologies.

Because of their versatility and controllable property profile, Desmopan® and Texin® TPUs play a key role in this strategy.

Shape memory - plastics that never forget

Shape memory plastics are intelligent TPU materials that can change their form under defined external parameters.  First, they are made into a permanent shape by conventional processing.  Then, a temporary simple form is impressed on the component. The original permanent form remains stored in the materials and can be recreated through heating.  The material "remembers" its original shape and can change back to it at any time.

The range of applications for such TPU materials is almost unlimited.  Applications include:

• Temperature sensors
• Artificial muscles
• Self-loosening screws and toys
• Garments that become either permeable or impermeable to body moisture depending on hot or cold conditions.

Intelligent modular solutions - flexible printed circuit systems

Thermoplastic polyurethanes have a particularly bright future in car production for flat, flexible printed circuit systems based on plastic film -- also called "smart wiring."  These systems are a space-saving alternative to normal cables for control currents. 

In addition to these "Flexible Flat Cables" (FFCs), Bayer is also developing a Flexible Printed Circuit (FPC) system also based on Desmopan TPU and intended to replace contemporary adhesive-containing systems.

A TPU film serves as a fusible bonding agent, and the conductive copper layer is encapsulated on both sides with a polycarbonate film.  The goal is to produce fully connected modules without the need for complex connecting systems.  Desmopan TPU is helping to drive the trend toward component modularization.